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RISTemperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The popcorning effect of plastic ball grid array (PBGA) packages is analyzed using the method of fracture mechanics. The following three specific problems are studied: (1) crack initiation in ...
Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joint reliability of flip chip on various thickness of printed circuit board with imperfect underfill is presented in this study. Emphasis is placed on the determination of the ...
A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal fatigue of solder joints is critical to the performance and reliability of electronic components. It is well known that the fatigue life of solder joints is rather difficult to be ...
Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate ...
Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel and reliable wafer level chip scale package (WLCSP) is investigated in this paper. It consists of a copper conductor layer and two low cost dielectric layers. The bump geometry consists ...
Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed ...