Abstract: Simple, closed-form expressions, based on elasticity theory, are derived for determining the location and magnitude of the maximum shearing displacement in a partial areal array of solder joints. ...

Abstract: An analytical model is developed for the problem of a thermally loaded electronic assembly consisting of a nonhomogeneous component attached to a substrate by means of an areal array of solder ...

Abstract: An improved time-dependent analytical model is developed for predicting the maximum shearing displacement in an area-array electronic assembly under global thermal mismatch loading. The thermal ...

Abstract: An analytical expression is derived for determining the maximum solder joint shearing displacement occurring in an a real-array interconnect under global CTE mismatch loading. The result may be ...

Abstract: An analytical model is developed for predicting the time-dependent shearing displacement in area-array solder interconnects due to global CTE mismatch under thermal cycling. As a first step toward ...