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RISAnalysis of Tombstoning Phenomenon During Reflow
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A dynamic model is established to investigate tombstoning phenomenon of passive SMT components during reflow. This model consists of three dynamic equations for the motion of the component and ...
CBGA Solder Fillet Shape Prediction and Design Optimization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we first present a mathematical method that can be used to predict the eutectic solder fillet shape for ceramic ball grid array joints. An underlying assumption is that the ...
Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. ...
Fine Pitch Stencil Printing Process Modeling and Optimization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present a statistical-neural network modeling approach to process optimization of fine pitch stencil printing for solder paste deposition on pads of printed circuit boards ...
The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As a follow-up and conclusion to previous work in stencil printing process modeling and optimization (Li et al., 1996), we investigate the effect of stencil printing optimization on the reliability ...
Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The field reliability of solder joints depends on the manufacturing process tolerance of design parameters and on the capability of manufacturing processes to achieve the tolerance. This process ...
Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity ...
Convective Heat Transfer From Longitudinal Fin Arrays in the Entry Region of Turbulent Flow
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experiments were performed to study the heat transfer from longitudinal fin arrays in turbulent air flow in the combined hydrodynamic and thermal entry region of a rectangular channel. The ...
Maximizing Solder Joint Reliability Through Optimal Shape Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The automated search techniques from the field of numerical optimization provide tools that enable optimal design of electronic packages in general, and solder joints in particular. However, there ...
An Analytical Cure Model for Underfill Epoxies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model relating the degree of cure of an underfill epoxy to the heat transfer coefficient of the heating process and time is presented. The model was verified experimentally by ...