Abstract: Two test specimens are developed to measure interfacial fracture toughness in flip-chip assemblies. The specimens consist of three layers: silicon chip, underfill, and circuit board. Two symmetric ...

Abstract: A mechanistic model is presented for predicting the effective dielectric constant and loss tangent of woven-fabric reinforced composites with low-loss constituents. A two-scale asymptotic homogenization ...

Abstract: The bearing capacity of an eccentrically obliquely loaded footing is determined by limit equilibrium analysis. The footing is considered rigid with a rough base. It is assumed that the rupture surface is a log spiral and ...

Abstract: In this paper, a novel approach is proposed to predict the pressure-settlement and pressure-tilt characteristics of eccentrically-obliquely loaded footings using the hyperbolic stress-strain curves of soils as nonlinear ...