Abstract: Microsystem packages continue to demand lower cost, higher reliability, better performance and smaller size. Compliant wafer-level interconnects show great potential for next-generation packaging. ...

Abstract: Amid the rapid development of building information technologies, wayfinding information has become more accessible to building users and first responders. As a result, a realistic risk of cognitive load related to the ...

Abstract: Robotic teleoperation has shown great potentials in various construction applications. With the advancements of virtual telepresence and motion capture technologies, bilateral teleoperation has been tested in precision ...

Abstract: Robot-assisted assembly has shown great potential in modular construction for the future. However, as the complexity of prefabricated structural modules increases, the likelihood of unexpected robotic collisions also rises, ...

Abstract: Monitoring data of civil structures mainly include load- and temperature-induced structural responses. Traditional damage-detection methods use vibration-based structure responses by eliminating temperature effects from ...

Abstract: Amid the rapid development of information communication technologies (ICTs), residents of future smart cities are expected to be exposed to unprecedented amounts of real-time information on a daily basis. The cognitive ...