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Editorial
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: I would like to thank Drs. Justin Gao and Judy Vance for their services as Associate Editors of the Journal of Mechanical Design during the last three years. I am pleased to inform you of ...
The Diffraction of Multidirectional Random Waves by Rectangular Submarine Pits
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The diffraction of multidirectional random surface waves with one or more rectangular submarine pits is investigated theoretically. The incident wave conditions are specified using a discrete form ...
A Message From the Special Issue Editor
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Time delay in dynamic systems has long been considered a complex phenomenon. One can see increased research activity on this topic since the early 1980s, and primarily from the mathematics ...
Experimental Observation of Lagrangian Coherent Structures in Perturbed Rayleigh-Benard Convection
Publisher: The American Society of Mechanical Engineers (ASME)
Prediction and Diagnosis of Propagated Errors in Assembly Systems Using Virtual Factories
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Large-scale automated assembly systems are widely used in automotive, aerospace and consumer electronics industries to obtain high quality products in less time. However, one disadvantage of these ...
Review of <i>Air Bubble Entrainment in Free Surface Turbulent Shear Flows</i> by Hubert Chanson
Publisher: American Society of Civil Engineers
Kinematic and Dynamic Simulation of a Dual-Beam Pumping Unit for Increasing Stroke and Reducing Force
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Based on a conventional walking-beam pumping unit, a dual-beam pumping unit for increasing stroke and reducing force is presented, and an approach involving computer kinematic and dynamic simulation ...
Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Multi-layered stacks are commonly used in microelectronic packaging. Traditionally, these systems are designed using linear-elastic analysis either with analytical solutions or finite element method. ...
Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with ...
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