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    Editorial 

    Source: Journal of Mechanical Design:;2002:;volume( 124 ):;issue: 003:;page 361
    Author(s): Prof. Lung-Wen Tsai
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: I would like to thank Drs. Justin Gao and Judy Vance for their services as Associate Editors of the Journal of Mechanical Design during the last three years. I am pleased to inform you of ...
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    ELECTRIC DISTURBANCES AND PERILS ON MOUNTAIN TOPS 

    Source: Monthly Weather Review:;1907:;Volume( 035 ):;issue: 012:;page 578
    Author(s): CHURCH, PROF. J. E.
    Publisher: American Meteorological Society
    Abstract: No Abstract Available.
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    The Diffraction of Multidirectional Random Waves by Rectangular Submarine Pits 

    Source: Journal of Offshore Mechanics and Arctic Engineering:;2004:;volume( 126 ):;issue: 001:;page 9
    Author(s): Hong Sik Lee; Prof.; A. Neil Williams; Prof.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The diffraction of multidirectional random surface waves with one or more rectangular submarine pits is investigated theoretically. The incident wave conditions are specified using a discrete form ...
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    A Message From the Special Issue Editor 

    Source: Journal of Dynamic Systems, Measurement, and Control:;2003:;volume( 125 ):;issue: 002:;page 157
    Author(s): Prof. Nejat Olgac; Guest Editor
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Time delay in dynamic systems has long been considered a complex phenomenon. One can see increased research activity on this topic since the early 1980s, and primarily from the mathematics ...
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    Experimental Observation of Lagrangian Coherent Structures in Perturbed Rayleigh-Benard Convection 

    Source: Journal of Fluids Engineering:;2022:;volume( 144 ):;issue: 004:;page 40902-1
    Author(s): Watanabe, Masahito; Yoshimura, Prof. Hiroaki
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Prediction and Diagnosis of Propagated Errors in Assembly Systems Using Virtual Factories 

    Source: Journal of Computing and Information Science in Engineering:;2001:;volume( 001 ):;issue: 003:;page 261
    Author(s): Cem M. Baydar; Kazuhiro Saitou; Assist. Prof.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Large-scale automated assembly systems are widely used in automotive, aerospace and consumer electronics industries to obtain high quality products in less time. However, one disadvantage of these ...
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    Review of <i>Air Bubble Entrainment in Free Surface Turbulent Shear Flows</i> by Hubert Chanson 

    Source: Journal of Hydraulic Engineering:;1997:;Volume ( 123 ):;issue: 012
    Author(s): Ian R. Wood, Prof. Emeritus, Reviewer
    Publisher: American Society of Civil Engineers
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    Kinematic and Dynamic Simulation of a Dual-Beam Pumping Unit for Increasing Stroke and Reducing Force 

    Source: Journal of Energy Resources Technology:;2004:;volume( 126 ):;issue: 004:;page 320
    Author(s): Lu Yi; D.Sc. Tech. Prof.; Tatu Leinonen; D.Sc. Tech. Prof.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Based on a conventional walking-beam pumping unit, a dual-beam pumping unit for increasing stroke and reducing force is presented, and an approach involving computer kinematic and dynamic simulation ...
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    Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging 

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003:;page 218
    Author(s): Cemal Basaran; Assoc. Prof. and Director; Ying Zhao; Senior Reliability Engineer
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Multi-layered stacks are commonly used in microelectronic packaging. Traditionally, these systems are designed using linear-elastic analysis either with analytical solutions or finite element method. ...
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    Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001:;page 134
    Author(s): Yujun Wen; PhD candidate; Cemal Basaran; Assoc. Prof. and Director
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with ...
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