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RISRational Finite Elements and Flexible Body Dynamics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The goal of this study is to develop the dynamic differential equations of the first finite element based on the rational absolute nodal coordinate formulation (RANCF) and to demonstrate its ...
Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present the design of a passive test chip with thermal test structures in the Metal 1 layer of the back-end of line (BEOL) for the experimental thermal characterization of the intertier thermal resistance ...
Edge Trimming Induced Defects on Direct Bonded Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The diamond abrasive process which is applied onto the silicon wafer edge, the so called “edge trimming,” is an important step in three-dimensional microelectronics processing technology, due to the significant thickness ...