Abstract: Packing and routing separately are each challenging NP-hard problems. Therefore, solving the coupled packing and routing problem simultaneously will require disruptive methods to better address pressing-related challenges, ...

Abstract: A new method for optimizing the layout of device-routing systems is presented. Gradient-based topology optimization techniques are used to simultaneously optimize both device locations and routing paths of device interconnects. ...

Abstract: High power density systems require efficient cooling to maintain their thermal performance. Despite this, as systems get larger and more complex, human expertise and insight may not suffice to determine the desired thermal ...

Abstract: Three-dimensional spatial packaging of interconnected systems with physical interactions (SPI2) design plays a vital role in the functionality, operation, energy usage, and life cycle of practically all engineered systems, ...

Abstract: High-performance cooling is often necessary for thermal management of high power density systems. However, human intuition and experience may not be adequate to identify optimal thermal management designs as systems increase ...

Abstract: Systematic enumeration and identification of unique 3D spatial topologies (STs) of complex engineering systems (such as automotive cooling systems, electric power trains, satellites, and aero-engines) are essential to ...

Abstract: This article presents a novel three-dimensional topology optimization framework developed for 3D spatial packaging of interconnected systems using a geometric projection method (GPM). The proposed gradient-based topology ...