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RISModeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Finite element modeling (FEM) is an important component in the design of reliable chip-to-substrate connections. However, FEM can quickly become complex as the number of input/output connections ...
Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption ...
Electroless Deposition and Characterization of PtxRu1−x Catalysts on Pt/C Nanoparticles for Methanol Oxidation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electroless deposition of PtxRu1−x catalysts using hydrazine dihydrochloride or formic acid as the reducing agent in a modified Leaman bath was investigated. The effect of potential on the ...