Abstract: The effects of underfill selection on flip chip reliability were always a complex issue. Mechanical optimization of the underfill performance, achieved by the addition of appropriate fillers, is ...

Abstract: The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the ...

Abstract: Underfilling will almost certainly improve the performance of an area array assembly in drop, vibration, etc. However, depending on the selection of materials, the thermal fatigue life may easily ...

Abstract: An elastic analysis is developed to provide estimates of the stresses in area array solder joints during thermal excursions. The analysis provides a rapid quantitative evaluation of the important ...

Abstract: The interfacial fracture resistance of a polyimide passivation/underfill interface was measured using an asymmetric double cantilever beam technique. A thin layer of polyimide was coated on a ...