Abstract: Progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field ...

Abstract: Thermal interface materials (TIMs) play a critical role in conventionally packaged electronic systems and often represent the highest thermal resistance and/or least reliable element in the heat flow path from the chip to ...

Abstract: A study was conducted to experimentally characterize the pool boiling performance of hydrofluorocarbon HFC245fa at pressures ranging from 0.15 MPa to 1.1 MPa (reduced pressure range: 0.04–0.31). Pool boiling experiments ...

Abstract: This study characterizes the pool boiling performance of HFO1234yf (hydrofluoroolefin 2,3,3,3tetrafluoropropene). HFO1234yf is a new, environmentally friendly refrigerant likely to replace HFC134a in automotive airconditioning ...

Abstract: We hope that you find the content of the Special Issues useful and wish you the very best.The two-part 2019 InterPACK Special Issues of the ASME Journal of Electronic Packaging (JEP) was developed from manuscripts submitted ...

Abstract: An experimental investigation was conducted to examine the use of microstructured surfaces to enhance jet impingement heat transfer. Three microstructured surfaces were evaluated: a microfinned surface, a microporous ...

Abstract: One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal ...

Abstract: With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates ...