Abstract: The microstructure-macroproperty relation of electronic composites is studied by use of the Eshelby’s method which has been extended to treat the inclusion problem of thermal and electromagnetic ...

Abstract: When a coated short fiber composite is subject to temperature change, thermal stresses in and around the coated fibers are induced due to the mismatch of thermal expansion coefficients of the ...

Abstract: The in-plane electrical conductivity of a misoriented short fiber composite was studied both by fiber percolation model (FPM) and effective medium theory (EMT). A misoriented short fiber composite ...

Abstract: Two models for predicting the stress-strain curve of porous NiTi under compressive loading are presented in this paper. Porous NiTi shape memory alloy is considered as a composite composed of ...

Abstract: When a coated short fibre composite is subjected to temperature change, thermal stresses in and around the coated fibres are induced due to the mismatch of thermal expansion coefficients of ...

Abstract: A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and ...

Abstract: A thermal energy harvester using piezo-shape memory alloy (SMA) composite was designed. The main mechanism of such a piezo-SMA composite is the synergistic effect of piezoelectrics and SMA, which ...

Abstract: We are in the process of developing a micro-temperature sensor array with T-type (copper–constantan) thin film thermocouples (TFTCs) to measure the chip temperature distribution of electronic ...

Abstract: An analytical model to predict dimensional changes in thermal cycled metal matrix composites (MMCs) with and without constant stress is proposed. The present model assumes that the temperature-time ...