Abstract: A means to properly size rectangular heat spreaders between a dielectric layer connected to thermal ground and a power device is developed by modeling the problem as a thermal resistance ...

Abstract: We describe a technology in which multiple components inside a circuit pack shielded from electromagnetic interference (EMI) are efficiently cooled by individual heat sinks that protrude into an ...

Abstract: Robust precision temperature control of heat-dissipating photonics components is achieved by mounting them on thermoelectric modules (TEMs), which are in turn mounted on heat sinks. However, the ...

Abstract: The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems ...