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RISMechanical Testing for Stretchable Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Stretchable electronics have been a subject of increased research over the past decade (Lacour, S., et al., 2006, “Mechanisms of Reversible Stretchability of Thin Metal Films on Elastomeric Substrates,” Appl. Phys. Lett., ...
Characterization of Bulk and Thin Film Fracture in Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As semiconductor packaging technologies continue to scale, it drives the use of existing and new materials in thin layer form factors. Increasing packaging complexity implies that materials in thin layers are subject to ...
Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper intends to address an important gap between reliability standards and the physics of how components respond to real use conditions using a knowledge-based qualification (KBQ) process. Bridging the gap is essential ...
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the use of the double cantilever beam (DCB) method for characterizing the adhesion strength of interfaces in advanced microelectronic packages at room and high temperatures. Those interfaces include ...
Mechanical Characterization of Thermal Interface Materials and Its Challenges
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ...
Mechanical Characterization of Thermal Interface Materials and Its Challenges
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ...