Abstract: The well-known, closed-form solution to thermal stresses of a die-substrate assembly is initially provided by Suhir in the mid-1980’s after Timoshenko [1] and Chen and Nelson [2]. It has been ...

Abstract: Recently, the 3D or stacked-die packages become increasingly popular for packaging ICs into a system or subsystem to satisfy the needs of low cost, small form factor, and high performance. For ...