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    Small Scale Contact Conditions for the Linear-Elastic Interface Crack 

    Source: Journal of Applied Mechanics:;1988:;volume( 055 ):;issue: 004:;page 814
    Author(s): Peter M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Conditions are discussed for which the contact zone at the tip of a two-dimensional interface crack between anisotropic elastic materials is small. For such “small scale contact” conditions ...
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    Timoshenko Beam Dynamics 

    Source: Journal of Applied Mechanics:;1971:;volume( 038 ):;issue: 003:;page 591
    Author(s): G. M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The general problem of Timoshenko beam analysis is solved using the Laplace transform method. Time-dependent boundary and normal loads are considered. It is established that the integrands of ...
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    A Comparison of Computational and Experimental Results for Flow and Heat Transfer From an Array of Heated Blocks 

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001:;page 32
    Author(s): A. M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper summarizes computational results for flow and heat transfer over an array ofidealized electronic components and compares them to experimental data. The numerical modeling was performed ...
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    Adjudication in the United Kingdom: Constitutional Implications 

    Source: Journal of Professional Issues in Engineering Education and Practice:;2008:;Volume ( 134 ):;issue: 003
    Author(s): Richard N. M. Anderson
    Publisher: American Society of Civil Engineers
    Abstract: Good ideas are often overtaken by great events. That happened to adjudication. Originally envisaged as a single concept applying across the United Kingdom, it has been overtaken by more significant constitutional change. ...
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    Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004:;page 310
    Author(s): Ann M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In many heat transfer situations, such as those found in the electronics cooling field, more than a single mode of heat transfer occurs. For example, modules on a printed circuit board dissipate ...
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    Spalling Brick—Material, Design or Construction Problem? 

    Source: Journal of Performance of Constructed Facilities:;1999:;Volume ( 013 ):;issue: 004
    Author(s): Lindsay M. Anderson
    Publisher: American Society of Civil Engineers
    Abstract: A 1987 addition to a Midwest high school included the use of a white utility brick. The original building was surrounded on three sides by the new addition, which provided a striking appearance. Approximately 4 years after ...
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    Technology and the Limits to Growth 

    Source: Journal of Manufacturing Science and Engineering:;1973:;volume( 095 ):;issue: 001:;page 365
    Author(s): J. M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Simulation studies performed over the past two years by a team of scientists at the Massachusetts Institute of Technology indicate that there, are physical limits to the growth of population ...
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    Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004:;page 375
    Author(s): I. Mudawar; T. M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A high power electronic chip was simulated experimentally to investigate upper cooling capabilities using a variety of pool boiling enhancement techniques. Parametric effects of system pressure, ...
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    Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001:;page 89
    Author(s): I. Mudawar; T. M. Anderson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A high flux electronic chip was numerically and experimentally simulated to investigate pool boiling capabilities of enhanced metallic surface attachments built upon a 12.7 × 12.7 mm2 base ...
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    The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001:;page 14
    Author(s): Ann M. Anderson; Robert J. Moffat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper describes an investigation of the forced convection heat transfer and pressure drop characteristics of a regular in-line array of flatpacks for several channel heights and inlet ...
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