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    A Sensitive Ultrasonic Approach to NDE of Tightly Closed Small Cracks 

    Source: Journal of Pressure Vessel Technology:;1998:;volume( 120 ):;issue: 004:;page 384
    Author(s): S. R. Ahmed; M. Saka
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A sensitive ultrasonic technique for the quantitative nondestructive evaluation of small closed cracks is developed. The use of an oblique longitudinal wave with small angle of incidence upon ...
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    Microwave Imaging for the Integrity Assessment of IC Packages 

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001:;page 42
    Author(s): Y. Ju; H. Abé; M. Saka
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Since IC packages have been made thinner and smaller, the delamination and crack, which may be induced in the soldering process, have become important factors affecting the reliability of the ...
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    Use of Cavitating Jet for Introducing Compressive Residual Stress 

    Source: Journal of Manufacturing Science and Engineering:;2000:;volume( 122 ):;issue: 001:;page 83
    Author(s): H. Soyama; J. D. Park; M. Saka
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In an attempt to strengthen the surface of materials, the potential of using a cavitating jet to form compressive residual stress has been investigated. Introducing compressive residual stress ...
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    NDE of a Crack by Using Closely Coupled Probes for DCPD Technique 

    Source: Journal of Pressure Vessel Technology:;1996:;volume( 118 ):;issue: 002:;page 198
    Author(s): M. Saka; A. Oouchi; H. Abé
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In order to enhance the sensitivity of the d-c potential drop technique, the principle of a technique using the closely coupled probes is proposed. A calibration equation for this technique ...
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    Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 367
    Author(s): S. Kamiya; H. Abé; H. Takahashi; M. Saka
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Diamond film produced by chemical vapor deposition (CVD) is being used in the electronics industry because of their excellent properties. In order to measure the adhesive strength of CVD diamond, ...
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    A New Approach to Calculate Atomic Flux Divergence by Electromigration 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 360
    Author(s): K. Sasagawa; H. Abé; N. Nakamura; M. Saka
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, a new calculation method of the atomic flux divergence used to predict the formation of electromigration-induced void is proposed by considering two-dimensional distributions of ...
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    Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 002:;page 21003
    Author(s): X. Zhao; M. Yamashita; F. Togoh; M. Saka
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper is focused on evaluating the dominant factor for electromigration (EM) in sputtered high purity Al films. A closed-form equation of atomic flux divergence by treating grain boundary ...
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    Analysis of Interaction of Multiple Cracks in a Direct Current Field and Nondestructive Evaluation 

    Source: Journal of Applied Mechanics:;1999:;volume( 066 ):;issue: 002:;page 468
    Author(s): H. Liu; M. Saka; H. Abé; I. Komura; H. Sakamoto
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A method of analysis is proposed for nondestructive evaluation of multiple cracks by means of the d.c. (direct current) potential drop technique. Two and three-dimensional multiple cracks are ...
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    NDE of a 3-D Surface Crack Using Closely Coupled Probes for DCPD Technique 

    Source: Journal of Pressure Vessel Technology:;1998:;volume( 120 ):;issue: 004:;page 374
    Author(s): M. Saka; D. Hirota; H. Abé; I. Komura
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A procedure of applying the d-c potential drop technique using the closely coupled probes to NDE of a 3-D surface crack is newly developed. The calibration equation for three sensors which ...
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    Does the Process Zone Control Crack Growth? 

    Source: Applied Mechanics Reviews:;1992:;volume( 045 ):;issue: 008:;page 367
    Author(s): H. Abé; T. Hashida; M. Saka; S. Ohba
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Fracture toughness tests were carried out by using small compact tension specimens of Westerly granite. Relation between the load-line displacement and the initial crack-tip separation changed ...
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