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Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In extreme environmental applications, such as aerospace and automotive, electronics may endure high or low operating temperatures during service, handling, and storage. An electronic assembly may experience strain rates ...
Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and ...
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as download drilling, aircraft, and transportation. Temperatures in the vehicle ...
Stress–Strain Behavior of SAC305 at High Strain Rates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronic products are subjected to high Glevels during mechanical shock and vibration. Failuremodes include solderjoint failures, pad cratering, chipcracking, copper trace fracture, and underfill fillet failures. The ...
High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and ...