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    Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21116-1
    Author(s): Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In extreme environmental applications, such as aerospace and automotive, electronics may endure high or low operating temperatures during service, handling, and storage. An electronic assembly may experience strain rates ...
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    Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys 

    Source: Journal of Electronic Packaging:;2020:;volume( 143 ):;issue: 002:;page 021005-1
    Author(s): Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and ...
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    Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method 

    Source: Journal of Electronic Packaging:;2023:;volume( 146 ):;issue: 002:;page 21004-1
    Author(s): Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as download drilling, aircraft, and transportation. Temperatures in the vehicle ...
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    Stress–Strain Behavior of SAC305 at High Strain Rates 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 001:;page 11010
    Author(s): Lall, Pradeep; Shantaram, Sandeep; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Electronic products are subjected to high Glevels during mechanical shock and vibration. Failuremodes include solderjoint failures, pad cratering, chipcracking, copper trace fracture, and underfill fillet failures. The ...
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    High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041104-1
    Author(s): Lall, Pradeep; Mehta, Vishal; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and ...
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