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    Additively Printed Multilayer Substrate Using Aerosol-Jet Technique 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041110-1
    Author(s): Lall, Pradeep; Goyal, Kartik; Kothari, Nakul; Leever, Benjamin; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Printing technologies, such as aerosol-jet, open possibilities of miniaturizing interconnects and designing circuits on nonplanar surfaces. Aerosol-jet is a direct-printing technique that provides an alternative manufacturing ...
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    Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041003-1
    Author(s): Lall, Pradeep; Abrol, Amrit; Kothari, Nakul; Leever, Benjamin; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Traditionally, printed circuit assemblies have been fabricated through a combination of imaging and plating-based subtractive processes involving the use of photo-exposure followed by baths for plating and etching in order ...
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    Special Issue on InterPACK 2018 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 30301
    Author(s): Dede, Ercan M.; Boteler, Lauren; Chen, Changqing; Gromala, Przemyslaw Jakub; Leever, Benjamin; Li, Wei
    Publisher: American Society of Mechanical Engineers (ASME)
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian