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    Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging 

    Source: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 001:;page 11108-1
    Author(s): Lall, Pradeep; Jang, Hyesoo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Due to the necessity for flexibility without compromising the Li-ion battery (LIB) state of health (SOH), LIB is a critical challenge for flexible hybrid electronic (FHE) devices. A thin form factor-based LIB with a thickness ...
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    Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004:;page 41013
    Author(s): Lall, Pradeep; Lowe, Ryan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper compares three prognostic algorithms applied to the same data recorded during the failure of a solder joint in ball grid array component attached to a printed circuit board. The objective is to expand on the ...
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    Assessment of Lumen Degradation and Remaining Life of Light Emitting Diodes Using Physics Based Indicators and Particle Filter 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 002:;page 21002
    Author(s): Lall, Pradeep; Zhang, Hao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The development of lightemitting diode (LED) technology has resulted in widespread solid state lighting (SSL) use in consumer and industrial applications. Previous researchers have shown that LEDs from the same manufacturer ...
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    High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041104-1
    Author(s): Lall, Pradeep; Mehta, Vishal; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and ...
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    Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21112-1
    Author(s): Lall, Pradeep; Soni, Ved; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The demand for wearable consumer electronics, fitness accessories, and biomedical equipment has led to the growth research and development of thin flexible batteries. Wearable equipment and other asset monitoring applications ...
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    Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization 

    Source: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002:;page 21011-1
    Author(s): Lall, Pradeep; Goyal, Kartik; Hill, Curtis
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in ...
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    Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging 

    Source: Journal of Electronic Packaging:;2025:;volume( 147 ):;issue: 002:;page 21006-1
    Author(s): Lall, Pradeep; Jang, Hyesoo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flexible hybrid electronics featuring wearable electronics offer numerous advantages such as function integration, light-weighting, and flexibility. However, the dynamic flexing of the flexible power sources during usage, ...
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    Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications 

    Source: Journal of Electronic Packaging:;2023:;volume( 145 ):;issue: 001:;page 11109-1
    Author(s): Lall, Pradeep; Choudhury, Padmanava; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production ...
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    Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41116-1
    Author(s): Lall, Pradeep; Bimali, Sabina; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The demand for compact, lightweight, and stretchable printed electric circuits has increased with the advancement of flexible printing technology in electronics. The viability of environmentally friendly water-based inks ...
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    Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041113-1
    Author(s): Lall, Pradeep; Thomas, Tony; Yadav, Vikas; Narangaparambil, Jinesh; Liu, Wei
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The use of flexible electronics wearable applications has prompted the need to understand the stresses imposed during human motion for a range of activities. Wearable applications may involve situations in which the ...
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