Abstract: The delamination of thin coating films from substrates is a critical issue for the reliability of micro- and nanoelectronic devices. Indentation methods have the potential to measure interfacial ...

Abstract: Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. ...

Abstract: In this paper, the effects of the axial load and the elastic matrix on the flexural wave in the carbon nanotube are studied. Based on the nonlocal continuum theory and the Timoshenko beam ...

Abstract: A new approach is presented for investigating the dispersive character of structural waves. The wavelet transform is applied to the time-frequency analysis of dispersive waves. The flexural wave ...

Abstract: Experts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ...