Abstract: The increasing need to create high density and fine pitch electronic interconnections presents a number of challenges. The fatigue-induced solder joint failure of surface mounted electronic devices ...

Abstract: In the literature, the local-global finite element analysis technique plays a very important role in the area array packaging. In this study, the underlying goal is to propose an improved ...

Abstract: Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and ...

Abstract: The demands for electronic packages with lower profile, lighter weight, and higher input/output (I/O) density have led to rapid expansion in flip chip, chip scale package (CSP) and wafer level ...