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RISA Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An effort has been made in this study to develop a model which can predict wire sweep during semiconductor chip encapsulation with transfer molding. The calculation of wire sweep during ...
Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, flow during the filling and post-filling stages in semiconductor chip encapsulation has been analyzed. A finite-element method based on the Hele-Shaw approximation is used for the ...
Flow Analysis in a Chip Cavity During Semiconductor Encapsulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, methods to analyze the flow during semiconductor chip encapsulation have been developed. A numerical method is used for the flow analysis in the chip cavity. In this study, for ...
Optimization of Inertia Welding Process by Response Surface Methodology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The inertia welding process was investigated using Response Surface Methodology. The optimum welding condition to yield maximum breaking strength at the weld was attained through a steepest ascent ...
A Computer-Aided Cooling-Line Design System for Injection Molds
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a methodology for analyzing the heat-transfer process during the injection molding of plastics as an aid to mold design. A numerical scheme using the Boundary Element Method ...
CAE of Mold Cooling in Injection Molding Using a Three-Dimensional Numerical Simulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In recent years, increased attention has been paid to the design of cooling systems in injection molding, as it became clear that cooling affects both productivity and part quality. In order ...
Integrated Simulation of Fluid Flow and Heat Transfer in Injection Molding for the Prediction of Shrinkage and Warpage
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work employs a coupled analysis of the fluid flow and heat transfer in the polymer melt during the filling and post-filling stages of the injection-molding process and of mold cooling/heating ...
Geometric Representation of Translational Swept Volumes and its Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a method for representing the geometries of translational swept volumes of three-dimensional objects which can be constructed by the union of three types of primitive objects: ...
Temperature Responses and Experimental Errors for Multitooth Milling Cutters
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A milling cutter temperature measuring technique was devised using garter spring pickups and standard thermocouples positioned at the back of inserts. Temperature signals as many as eight teeth ...
Numerical Simulation of the Coinjection Molding Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Coinjection molding comprises sequential or concurrent injection of two different but compatible polymer melts into a cavity in which the materials laminate and solidify. This innovative process ...