Abstract: A generalized multi-domain Rayleigh-Ritz (MDRR) approach developed by Ling and Dasgupta (1995), is extended in this paper, to obtain the stress field in flip chip solder interconnects, under ...

Abstract: Recently, accelerated testing of surface mount interconnects under combined temperature and vibration environments has been recognized to be a necessary activity to ensure enhanced test-time ...

Abstract: The effect of underfill material on reliability of flip chip on board (FCOB) assemblies is investigated in this study by using two-dimensional and three-dimensional finite element simulations ...