Abstract: An effort has been made in this study to develop a model which can predict wire sweep during semiconductor chip encapsulation with transfer molding. The calculation of wire sweep during ...

Abstract: In this paper, flow during the filling and post-filling stages in semiconductor chip encapsulation has been analyzed. A finite-element method based on the Hele-Shaw approximation is used for the ...

Abstract: In this paper, methods to analyze the flow during semiconductor chip encapsulation have been developed. A numerical method is used for the flow analysis in the chip cavity. In this study, for ...

Abstract: The inertia welding process was investigated using Response Surface Methodology. The optimum welding condition to yield maximum breaking strength at the weld was attained through a steepest ascent ...

Abstract: This paper presents a methodology for analyzing the heat-transfer process during the injection molding of plastics as an aid to mold design. A numerical scheme using the Boundary Element Method ...

Abstract: In recent years, increased attention has been paid to the design of cooling systems in injection molding, as it became clear that cooling affects both productivity and part quality. In order ...

Abstract: A method is presented for predicting the occurrence of a hysteresis phenomenon, which is observed in experimental results dealing with the instability of rotor-bearing systems. The method is ...

Abstract: A computationally attractive method for determining the optimal control of unconstrained linear dynamic systems with quadratic performance indices is presented. In the proposed method, the difference ...