Abstract: Topology optimization of an aircooled heat sink considering heat conduction plus sidesurface convection is presented. The optimization formulation is explained along with multiple design examples. A postprocessing procedure ...

Abstract: Transient liquid phase sintering (TLPS) is a novel high-temperature attach technology. It is of particular interest for application as die attach in power electronic systems because of its high-melting temperature and high ...

Abstract: The present work is related to the design of a manifold mini/microchannel heat sink with high modularity and performance for electronics cooling, utilizing two well established (i.e., jet impingement and channel flow) ...

Abstract: The effect of a variety of surface enhancements on the heat transfer achieved with an array of impinging jets is experimentally investigated using the dielectric fluid HFE7100 at different volumetric flow rates. The ...

Abstract: Design optimization of a three-dimensional (3D) heat flow structure for power electronics gate drive circuit thermal management is described. Optimization methods are described in the creation of several structural concepts ...

Abstract: The heat transfer and hydraulic performance of a flat evaporator, pump-assisted capillary loop cooler is evaluated for a 1cm2 heat source. The cooler consists of a copper manifold that houses a compensation chamber that ...