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RISReliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal and mechanical responses of a 304-Pin, 0.5 mm pitch, 40 mm by 40 mm body size plastic quad flat pack (QFP) solder joints and leads have been determined in this study. The thermal ...
Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the advantage of TSOP with copper leads is shown by comparing: (1) the calculated stress and strain in the solder joints with that of the TSOP with Alloy 42 lead frames (Lau ...
Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very ...
Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different ...
Special Issue on Mechanics of Surface Mount Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)