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RISEshelby Tensor for an Elastic Inclusion With Slightly Weakened Interface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The Eshelby tensor for an ellipsoidal inclusion in an elastic matrix of infinite extent is considered in this paper. Instead of assuming perfect bonding between the inclusion and the matrix, ...
Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a previous study, we found that moisture preconditioning strongly influenced the interfacial fracture toughness of the underfill/solder mask interface, decreasing the interfacial adhesion by ...
Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, ...
Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in ...
A Technique to Measure Interfacial Toughness Over a Range of Phase Angles
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental technique using sandwiched Brazil-nut specimens to quantitatively characterize interfacial fracture toughness over a wide range of phase angles is presented. Specimens are made by ...
Guided Circumferential Waves in a Circular Annulus
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A two-dimensional circular annulus is considered in this paper as a waveguide. The guided steady-state time-harmonic waves propagating in the circumferential direction are studied. It is found ...
Three-Dimensional Interface Cracks in Anisotropic Bimaterials: The Non-Oscillatory Case
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two-dimensional interface cracks in anisotropic bimaterials have been studied extensively in the literature. However, solutions to three-dimensional interface cracks in anisotropic bimaterials are ...
Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being the principal cause of many premature package failures. Of particular concern ...
Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reported in this paper is a quantum mechanics study on the electronic structure and contact resistance at the interfaces formed when an open-end single-walled carbon nanotube (CNT) is in ...
Characterization of Cement-Based Materials Using Diffuse Ultrasound
Publisher: American Society of Civil Engineers
Abstract: The objective of this research is to develop a quantitative understanding of the propagation of ultrasonic waves in cement-based materials by examining specimens made of a portland cement-paste matrix and glass bead ...