Abstract: Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests, measuring a thermal resistance value for a single component on a standard ...

Abstract: Flow fields within two miniature-scale centrifugal pumps are measured and analyzed to facilitate an understanding of how scaling influences performance. A full-scale pump, of impeller diameter ...

Abstract: The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically ...

Abstract: To achieve reductions in the power consumption of the data center cooling infrastructure, the current strategy in data center design is to increase the inlet temperature to the rack, while the ...

Abstract: The chiller cooled data center environment consists of many interlinked elements that are usually treated as individual components. This chain of components and their influences on each other ...

Abstract: Impinging jet arrays provide a means to achieve high heat transfer coefficients and are used in a wide variety of engineering applications such as electronics cooling. The objective of this ...

Abstract: Contemporary electronic systems generate high component-level heat fluxes. Impingement cooling is an effective way to induce high heat transfer coefficients in order to meet thermal constraints. ...

Abstract: In the drive to enhance data center energy efficiency, much attention has been placed on the prospect of airflow containment in hot-aisle cold-aisle raised floor arrangements. Such containment ...

Abstract: The power consumption of the chip package is known to vary with operating temperature, independently of the workload processing power. This variation is commonly known as chip leakage power, ...