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    Thermal Properties for Bulk Silicon Based on the Determination of Relaxation Times Using Molecular Dynamics 

    Source: Journal of Heat Transfer:;2010:;volume( 132 ):;issue: 001:;page 12401
    Author(s): Javier V. Goicochea; Marcela Madrid; Cristina Amon
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Molecular dynamics simulations are performed to estimate acoustical and optical phonon relaxation times, dispersion relations, group velocities, and specific heat of silicon needed to solve the ...
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    Hierarchical Modeling of Heat Transfer in Silicon-Based Electronic Devices 

    Source: Journal of Heat Transfer:;2010:;volume( 132 ):;issue: 010:;page 102401
    Author(s): Javier V. Goicochea; Marcela Madrid; Cristina Amon
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A hierarchical model of heat transfer for the thermal analysis of electronic devices is presented. The integration of participating scales (from nanoscale to macroscales) is achieved by (i) ...
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    Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 008:;page 82401
    Author(s): Javier V. Goicochea; Ming Hu; Bruno Michel; Dimos Poulikakos
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two mechanisms that enhance heat dissipation at solid-liquid interfaces are investigated from the atomistic point of view using nonequilibrium molecular dynamics simulation. The mechanisms include ...
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