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Thermal Properties for Bulk Silicon Based on the Determination of Relaxation Times Using Molecular Dynamics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Molecular dynamics simulations are performed to estimate acoustical and optical phonon relaxation times, dispersion relations, group velocities, and specific heat of silicon needed to solve the ...
Hierarchical Modeling of Heat Transfer in Silicon-Based Electronic Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A hierarchical model of heat transfer for the thermal analysis of electronic devices is presented. The integration of participating scales (from nanoscale to macroscales) is achieved by (i) ...
Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two mechanisms that enhance heat dissipation at solid-liquid interfaces are investigated from the atomistic point of view using nonequilibrium molecular dynamics simulation. The mechanisms include ...