Abstract: This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with ...

Abstract: Thermal fatigue failures of solder joints in electronic devices are a great concern in the electronics industry. Since the fatigue load is often in shear the details of thermal fatigue failure ...

Abstract: In this paper we report the behavior of the plastic deformation of an idealized crystal made by stacking parallel slip planes. Each slip plane is assumed to contain active sources of dislocations ...

Abstract: Isothermal fatigue data were collected for the compositions 5Sn-95Pb, 20Sn-80Pb, 40Sn-60Pb, 50Sn-50Pb and 63Sn-37Pb within the binary Sn-Pb system. All of these compositions are commercially available ...

Abstract: Near-eutectic Pb-Sn solders are widely used for joints in electrical devices. These are liable to failure by thermal fatigue during operation of the device. Since the thermal fatigue load is ...

Abstract: The creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65°C has been studied. The stress exponent, n, in the power law, γ̇ (steady state strain ...