Abstract: Engineering analysis of module-populated printed circuit cards subjected to torsion is pursued by approximate engineering analysis, numerical (finite element), and experimental means. The engineering ...

Abstract: As the mechanical, thermal, and electrical demands on 2nd and 3rd level electronic packages increase, so does the need for early dynamic analysis of the proposed design. Estimating effect of ...

Abstract: A zero insertion force (ZIF) connector was designed with the requirement of maintaining a specified contact normal force and wipe sufficient to achieve reliable electrical performance. In order ...