Search
CSV
RISThermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A generalized multi-domain Rayleigh-Ritz (MDRR) approach developed by Ling and Dasgupta (1995), is extended in this paper, to obtain the stress field in flip chip solder interconnects, under ...
Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of constant temperature and humidity environments on the durability of interconnects in underfilled Flip-Chip-on-Board (FCOB) assemblies is investigated in this study. Polymeric underfills, ...
Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of underfill material on reliability of flip chip on board (FCOB) assemblies is investigated in this study by using two-dimensional and three-dimensional finite element simulations ...