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RISInterior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In wiresaw manufacturing processes, such as those in slicing silicon wafers for electronics fabrication, abrasive slurry is carried by high-speed wire (5 to 15 m/s), which exerts normal load ...
Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wire saw slicing is a cost effective technology with high surface quality for slicing large diameter silicon wafers. Though wire saws have been deployed to cut polycrystalline and single crystal ...
Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Free abrasive machining (FAM) process associated with the wiresaw wafer slicing involves a three body abrasion environment. During the process, the cutting action is caused by fine abrasives ...
Measurement of Wafer Surface Using Shadow Moiré Technique With Talbot Effect
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a modified shadow moiré technique is applied to measure surface topology of wafers. When a wafer is sliced, either by an inner-diameter (ID) saw or wiresaw, the surface needs ...
Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Crystalline and polycrystalline ingots of silicon and other materials need to be cut into thin wafers for microelectronics, photovoltaics, and many other applications. For slicing process to be ...