Search
CSV
RISComparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of ...
Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Digital signal processing methods in a novel flip chip solder joint quality inspection system are presented. Laser ultrasound and interferometric system is a new approach for solder joint ...
Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel approach for flip-chip solder joint quality inspection based on vibration analysis is presented. Traditional solder joint inspection methods have their limitations when applied to flip ...
Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound ...
Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip ...
Warpage Analysis of Underfilled Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wafer-level packaging (WLP) is one of the future trends in electronic packaging. Since 1994, many companies have released various WLP licenses. One of the common concerns of WLP is wafer ...
A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The shadow moiré technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy, and is suitable for use in an online environment. ...
A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents potential application of stainless steel (SS) as a base substrate material for large area multi-chip module-deposited (MCM-D) packaging. Preliminary results on via formation ...
Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Potential application of stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 in. thick and ...
Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Previous related research has not developed a consensus on the issue of how stress analyses of plated-through hole (PTH)/printed wiring board (PWB) structure subject to uniform temperature change ...