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RISThermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal stress in silicon chips encapsulated in IC plastic packages is discussed. A stress-sensing chip which can detect the three-dimensional stress components separately is developed. Thermal ...
Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Since the thickness of stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease ...
A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The interconnection reliability of a contact-joint structure with anisotropic conductive film (ACF) or non-conductive film (NCF) was evaluated in terms of stability of the compressive force at ...