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    Numerical Study on the Local Aggregation of Helium Bubbles in Liquid Lithium and Its Thermal Analysis 

    Source: Journal of Thermal Science and Engineering Applications:;2024:;volume( 016 ):;issue: 008:;page 81005-1
    Author(s): Liu, Yongfu; He, Yi; Tan, Peng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Liquid lithium is widely regarded as an optimal cooling medium for space nuclear reactors due to its exceptional heat transfer properties and low density. However, the helium bubbles generated by liquid lithium under space ...
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    Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films 

    Source: Journal of Electronic Packaging:;2024:;volume( 147 ):;issue: 001:;page 11009-1
    Author(s): Chin, Ian; Loh, Wei Keat; Kee, Seow Chien; He, Yi; Abdullah, Mohd. Zulkifly; Tsuriya, Masahiro
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, high-temperature hygroscopic swelling characterization of different epoxy mold compounds (EMCs) and dielectric build-up films (DBFs) were analyzed using an experimental technique. The approach maintains ...
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    Mechanical Behavior of Steel–HFRC Composite Girders 

    Source: Journal of Bridge Engineering:;2018:;Volume ( 023 ):;issue: 010
    Author(s): Yu Liang He;Yi Qiang Xiang;Li Si Liu;Ying Yang
    Publisher: American Society of Civil Engineers
    Abstract: This paper presents the experimental and analytical results of a new composite girder that consists of a steel girder and hybrid fiber–reinforced concrete (HFRC) slab. First, six push-out tests were performed, and the test ...
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    Mechanical Characterization of Thermal Interface Materials and Its Challenges 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 001:;page 10804
    Author(s): Subramanian, Vijay; Sanchez, Jorge; Bautista, Joseph; He, Yi; Wang, Jinlin; Das, Abhishek; Schuldes, Jesus Gerardo Reyes; Yazzie, Kyle; Dhavaleswarapu, Hemanth K.; Malatkar, Pramod
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ...
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    Mechanical Characterization of Thermal Interface Materials and Its Challenges 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 001:;page 10804
    Author(s): Subramanian, Vijay; Sanchez, Jorge; Bautista, Joseph; He, Yi; Wang, Jinlin; Das, Abhishek; Schuldes, Jesus Gerardo Reyes; Yazzie, Kyle; Dhavaleswarapu, Hemanth K.; Malatkar, Pramod
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a ...
    Request PDF
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    DSpace software copyright © 2002-2015  DuraSpace
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