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RISCompact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three Dimensional Stacked Pin Fin Enhanced Microgap
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Overcooling of electronic devices and systems results in excess energy consumption, which can be reduced by closely linking cooling requirements with actual power dissipation. A thermal modelbased flow rate controller for ...
Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the first part of this paper, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps is presented. In the second part, complimentary to the literature review, new results ...
A Review of Two Phase Forced Cooling in Three Dimensional Stacked Electronics: Technology Integration
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking ...
Three Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ...