Abstract: Five-degree-of-freedom (5-DOF) characterization of the stability of a gas-lubricated conical bearing of the spiral-groove design is presented for bearing numbers up to 500. Critical points in ...

Abstract: In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a ...

Abstract: A new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are ...

Abstract: In this study, time-temperature-dependent nonlinear analyses of lead-free solder bumped wafer level chip scale package (WLCSP) on printed circuit board (PCB) assemblies subjected to thermal cycling ...

Abstract: Based on an energy method analyses of magnetoelastic buckling and bending of ferromagnetic thin plates in transverse, oblique, and longitudinal fields are performed in this paper. A general ...

Abstract: The rolling stream trail (RST) model introduces a new formulation of cavitation analysis of an eccentric journal bearing; it is presented as a preferred foundation for cavitation analysis of a ...

Abstract: This paper is concerned with the optimal design of triangular arches of a given volume of material for maximum buckling capacity. The buckling criteria of triangular arches are derived analytically by using stability ...

Abstract: An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed ...