Abstract: This study employed different cycle frequencies, to determine the influence of cycle frequency on the fatigue life of leaded chip carrier printed wiring board (LCC/PWB) interconnections. Real ...

Abstract: This paper describes the isothermal fatigue of leaded chip carrier to PWB interconnections. A split board technique was used to test the behavior of the Kovar leads and Sn63 solder joints ...

Abstract: This paper describes low cycle fatigue test run at −50°C, 35°C, 125°C, and 150°C on thin 60 Sn/40 Pb solder joints, tested in simple shear. The low cycle fatigue behavior ...

Abstract: This paper describes the 35°C and 150°C low cycle fatigue behavior of Sn96 solder (96.5 Sn/3.5 AG), the tin silver eutectic. There is a considerable amount of anecdotal information ...

Abstract: This paper describes the fatigue behavior of a Pb rich solder, 92.5Pb, 2.5Ag, 5.0Sn (Indalloy 151), tested at −50°C and +150°C. The results are compared to previously reported studies ...

Abstract: This study correlates previously published fatigue life data with the hysteresis energy, and compares this to the previous correlation’s with the applied plastic strain. It was found that, while ...