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    Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003:;page 31011
    Author(s): Xin Li; Xu Chen; Guo-Quan Lu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due ...
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    Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003:;page 208
    Author(s): John G. Bai; Jesus N. Calata; Guo-Quan Lu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling ...
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    Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 004:;page 41003
    Author(s): Yi Yan; Xu Chen; Xingsheng Liu; Yunhui Mei; Guo-Quan Lu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Conduction-cooled high power laser diodes have a variety of significant commercial, industrial, and military applications. For these devices to perform effectively, an appropriate die-attached ...
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