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Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due ...
Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling ...
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Conduction-cooled high power laser diodes have a variety of significant commercial, industrial, and military applications. For these devices to perform effectively, an appropriate die-attached ...