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    Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization 

    Source: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002:;page 21011-1
    Author(s): Lall, Pradeep; Goyal, Kartik; Hill, Curtis
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in ...
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    Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21119-1
    Author(s): Lall, Pradeep; Goyal, Kartik; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The transition of additive printed electronics into high-volume production requires process consistency to allow quality control of the manufactured product. Process recipes are needed for multilayer substrates with z-axis ...
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    Additively Printed Multilayer Substrate Using Aerosol-Jet Technique 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041110-1
    Author(s): Lall, Pradeep; Goyal, Kartik; Kothari, Nakul; Leever, Benjamin; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Printing technologies, such as aerosol-jet, open possibilities of miniaturizing interconnects and designing circuits on nonplanar surfaces. Aerosol-jet is a direct-printing technique that provides an alternative manufacturing ...
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