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RISAn Efficient Solution for Wire Sweep Analysis in IC Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Various methodologies of wire sweep analysis have been introduced to get better prediction and matching the experimental measurements by many researchers. As more and more high pin-count packages ...
Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing ...