Abstract: In the first part of this paper, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps is presented. In the second part, complimentary to the literature review, new results ...

Abstract: Power dissipated by modern microprocessors is a function of time and continuously changes with the workload, giving rise to temporal hotspots of local areas with very high power dissipation. A hybrid cooling scheme has ...

Abstract: We present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and twophase forced convection. Modeling includes (1) thermodynamic analysis ...

Abstract: Threedimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking ...

Abstract: This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ...

Abstract: As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ...

Abstract: It was with great sadness that the heat transfer community learned of the passing of Professor Raymond Viskanta on December 27, 2021.Raymond Viskanta was born in Marijampole, Lithuania in 1931. In 1944, his family escaped ...