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RISDevelopment of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C ...
Determination of Fracture Toughness of Thermally Conductive Adhesives
Publisher: The American Society of Mechanical Engineers (ASME)
Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal cyclic shear stress/strain hysteresis response and associated steady-state creep parameters of 97Sn-3Cu solder joints have been determined using a beam specimen previously developed by ...