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RISDesign, Fabrication, and Performance Evaluation of a Hybrid Wick Vapor Chamber
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: The growing electrification of transportation systems is dramatically increasing the waste heat that must be dissipated from high-density power electronics. Transformative embedded heat spreading technologies must be ...
Solid-State LiDAR With Optimized Dynamic Beam Power Intensity for Reduced Thermal Load
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Next generation sensor systems for automated vehicle navigation are likely to include light detection and ranging (LiDAR) sensors. Solid-state LiDAR technology that eliminates all mechanically moving parts is expected to ...
Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air Cooled Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Topology optimization of an aircooled heat sink considering heat conduction plus sidesurface convection is presented. The optimization formulation is explained along with multiple design examples. A postprocessing procedure ...
Thermal Metamaterials for Heat Flow Control in Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design ...
Modular Design for a Single Phase Manifold Mini/Microchannel Cold Plate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present work is related to the design of a manifold mini/microchannel heat sink with high modularity and performance for electronics cooling, utilizing two well established (i.e., jet impingement and channel flow) ...
Boiling Heat Transfer From an Array of Round Jets With Hybrid Surface Enhancements
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of a variety of surface enhancements on the heat transfer achieved with an array of impinging jets is experimentally investigated using the dielectric fluid HFE7100 at different volumetric flow rates. The ...
Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Design optimization of a three-dimensional (3D) heat flow structure for power electronics gate drive circuit thermal management is described. Optimization methods are described in the creation of several structural concepts ...
Special Issue on InterPACK 2018
Publisher: American Society of Mechanical Engineers (ASME)
Thermal Performance of a Pump-Assisted Capillary Loop Cooler
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The heat transfer and hydraulic performance of a flat evaporator, pump-assisted capillary loop cooler is evaluated for a 1cm2 heat source. The cooler consists of a copper manifold that houses a compensation chamber that ...
Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heterogeneous integration of electronics is critical to the next wave of electronics applications ranging from extremely power dense energy conversion systems to advanced chiplet and copackaged optics architectures for ...