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RISInfluence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Portable electronic devices are commonly exposed to shock and impact loading due to accidental drops. After external impact, internal collisions (termed “secondary impacts” in this study) between vibrating adjacent ...
Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Mode†Deformations in the Printed Wiring Board
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Design rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of everincreasing demand for functionality and miniaturization. As a result, ...
Electroplated Connections Between Carbon Fiber and Nickel
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Carbon has become an attractive material for electronic packaging applications, such as interconnects, because of its low density and reasonable electrical conductivity. One challenge in these applications is overcoming ...
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Sintered silver is a popular material for printing conductive traces in printed hybrid electronics (PHE). However, due to the novel materials and printing techniques in PHEs, reliability still needs to be adequately ...
Simulation of Secondary Contact to Generate Very High Accelerations
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigates the design of a typical commercially available drop system for generating very high shock and drop accelerations. Some commercially available drop towers produce accelerations greater than 5000 G ...
Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Most solders used in electronic systems have lowmelting temperature and hence experience significant amount of creep deformation throughout their lifecycle because typical operational and test conditions represent high ...
Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper focuses on the response of printed hybrid electronic (PHE) assemblies with polymeric substrates and additively manufactured sintered silver electrical traces subject to extreme mechanical shocks (up to 100,000 g) ...
Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Multiaxial and uniaxial vibration experiments were conducted in order to study the differences in failure modes and fatigue life for the two types of excitation. An electrodynamic (ED) shaker capable of controlled vibration ...
Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper focuses on the influence of carrier gas flow rate (CGFR) and sheath gas flow rate (SGFR) on the quality of conductive traces printed with nanoparticle inks using aerosol jet printing (AJP). This investigation ...