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    Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001:;page 41
    Author(s): D. S. Stone
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This article provides elasticity solutions to the indentation of a bilayer by three-sided and four-sided indentors. These solutions aid characterization of thin film elastic moduli through continuous ...
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    The Creep-Fatigue Interaction in Solders and Solder Joints 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002:;page 100
    Author(s): D. S. Stone
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can ...
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    Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002:;page 118
    Author(s): S.-M. Lee; D. S. Stone
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Room temperature, displacement-controlled tensile test and displacement-controlled tension/compression fatigue tests were performed on as-cast specimens of eutectic Pb-Sn solder with lamellar microstructure. ...
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