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    The Effective Thermal Conductivity of a Packing of Spheres 

    Source: Journal of Applied Mechanics:;1990:;volume( 057 ):;issue: 003:;page 789
    Author(s): A. Jagota; C. Y. Hui
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The anisotropic effective thermal conductivity of a random packing of spheres is derived. The conductivity is closely related to the fabric tensor of the theory of granular materials. The ...
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    Eddy Current Flow Near Cracks in Thin Plates 

    Source: Journal of Applied Mechanics:;1985:;volume( 052 ):;issue: 004:;page 841
    Author(s): C. Y. Hui; A. Ruina
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The problem of magnetically induced eddy current flow in a thin cracked plate is posed and solved for a few special cases. The current density is singular at the tip of a nonconducting ...
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    A Complex-Variable Method for Two-Dimensional Internal Stress Problems and Its Applications to Crack Growth in Nonelastic Materials: Part I—Theory 

    Source: Journal of Applied Mechanics:;1987:;volume( 054 ):;issue: 001:;page 59
    Author(s): K. C. Wu; C. Y. Hui
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In Part I of this work, a systematic method based on a nonanalytic complex calculus is developed for two-dimensional internal stress problems. The method is employed to derive the internal ...
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    A Complex-Variable Method for Two-Dimensional Internal Stress Problems and Its Applications to Crack Growth in Nonelastic Materials: Part II—Applications 

    Source: Journal of Applied Mechanics:;1987:;volume( 054 ):;issue: 001:;page 65
    Author(s): K. C. Wu; C. Y. Hui
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In Part I of this work the internal stress due to a field of nonelastic strain in an infinite uncracked or cracked elastic body is derived for the case of antiplane shear, plane strain and ...
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    Evaluation of a Complex Stress Intensity Factor of Interface Cracks: A Perturbation Approach 

    Source: Journal of Applied Mechanics:;1993:;volume( 060 ):;issue: 001:;page 221
    Author(s): C. Y. Hui; Y. C. Chen
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Asymptotic Stress Field of a Mode III Crack Growing Along an Elastic/Elastic Power-Law Creeping Bimaterial Interface 

    Source: Journal of Applied Mechanics:;1994:;volume( 061 ):;issue: 002:;page 384
    Author(s): C.-Y. Hui; M. T. A. Saif
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The asymptotic stress field near the tip of a crack subjected to antiplane shear loading is analysed. The crack is growing quasi-statically along an elastic/elastic power-law creeping bimaterial ...
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    A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003:;page 267
    Author(s): C. Y. Hui; H. D. Conway; Y. Y. Lin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The residual stresses in thin films are explained using elementary mechanics. In particular, the range of validity of the well-known Stoney’s formula is examined using a strength of materials ...
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    Effect of Nonlinear Elastic Behavior on Bilayer Decohesion of Thin Metal Films From Nonmetal Substrates 

    Source: Journal of Applied Mechanics:;2002:;volume( 069 ):;issue: 004:;page 407
    Author(s): S. P. Baker; X. Wang; C.-Y. Hui
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Nonlinear unloading behavior has been observed in thin metal films on substrates. In the present work, the effects of this nonlinear unloading behavior on the strain energy release rate in ...
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    Chemically Driven Deformation of Polymers 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001:;page 68
    Author(s): C.-Y. Hui; Ronald C. Lasky; Edward J. Kramer; K.-C. Wu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Chemically driven deformation of polymer glasses is important in a variety of electronic packaging applications ranging from stripping of photoresists to diffusion of processing liquids into printed ...
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    A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 372
    Author(s): C. K. Gurumurthy; C.-Y. Hui; E. J. Kramer; J. Jiao; L. G. Norris
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We have developed a new technique that uses a noncontact fiber optic displacement sensor to investigate the crack growth along polymer interfaces under thermal fatigue conditions. This technique ...
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