Abstract: A major challenge in maintaining quality and reliability in today's microelectronics chips comes from the ever increasing levels of integration in the device fabrication, as well as from the high current densities. Transient ...

Abstract: The high current densities in today's microelectronic devices and microchips lead to hotspot formations and other adverse effects on their performance. Therefore, a computational tool is needed to not only analyze but also ...

Abstract: In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for ...

Abstract: With the ever increasing cooling demands of advanced electronics, thin film evaporation has emerged as one of the most promising thermal management solutions. High heat transfer rates can be achieved in thin films of liquids ...